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Sales Engineer

役職名: Sales Engineer
勤務地: 神奈川県
職種: 営業, 半導体
給与: 8.0M ~ 12.0M
求人番号: IJB2013180
掲載日: 2026/09/09 11:29

The Sales Engineer role offers the opportunity to drive business growth within the semiconductor industry by combining technical expertise with consultative sales skills. This position plays an important part in developing new customer relationships, expanding existing accounts, and promoting advanced semiconductor packaging and testing solutions in a global business environment.

Responsibilities

  • Generate new business opportunities through prospecting, networking, cold calling, and customer engagement.

  • Conduct product presentations, technical discussions, and solution demonstrations for customers.

  • Manage the full sales cycle, including opportunity development, negotiation, and contract closure.

  • Build and maintain strong relationships with existing and prospective customers.

  • Identify customer requirements and recommend suitable semiconductor packaging and testing solutions.

  • Achieve monthly, quarterly, and annual sales targets.

  • Maintain accurate customer, opportunity, and activity records within the CRM system.

  • Collaborate with internal teams to ensure customer satisfaction and successful project execution.

Requirements

  • Bachelor's degree or above.

  • Minimum 3 years of experience in sales, account management, business development, or a related customer-facing role.

  • Strong communication, negotiation, and interpersonal skills.

  • Proven track record of achieving or exceeding sales targets.

  • Business-level proficiency in both Japanese and English.

  • Experience using CRM tools and sales management systems.

  • Strong customer relationship management skills and a results-oriented mindset.

Benefits

  • Comprehensive social insurance coverage.

  • Career development opportunities within a global technology organisation.

About the Company

A company in the semiconductor packaging and testing industry, this organisation provides advanced semiconductor assembly, packaging, wafer bumping, and testing services to customers worldwide. The company specialises in high-performance packaging technologies and supports the development of innovative semiconductor solutions through advanced manufacturing and engineering capabilities.